congatec设计生产的散热片型号列表第1页

商品目录

散热片：151 条相关产品

型号	描述	参考价格	库存数量
CONGA-QMX6/HSP3-T	散热片 Standard heatspreader (Heatstack Solution) for Qseven module conga-QMX6 with CPU in NON-LIDDED FCBGA Package. Intended for following QMX6 modules: conga-QMX6/DC-1G eMMC4 (P/N 016102) conga-QMX6/QC-1G eMMC4 (P/N 016103) conga-QMX6/QC-2G eMMC4 (P/N 016 PDF数据手册	暂无价格	参考库存:45226
CONGA-BAF/CSP-T	散热片 PASSIVE COOLING SOL conga-BAF 2.5mm PDF数据手册	暂无价格	参考库存:45216
CONGA-UMX6/HSP1-B	散热片 Standard heatspreader for conga-UMX6 module with Lidded FCBGA CPU. Stand-offs are with 2x M2.5 threaded and 2x borehole 2,7mm variants. PDF数据手册	暂无价格	参考库存:45159
CONGA-B7AC/HSP-VC-T	散热片 Standard heatspreader for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber. Intended for modules with TDP higher than 17W VC = Vapor Chamber T = M2.5 threaded stand-offs PDF数据手册	暂无价格	参考库存:44989
CONGA-XAF/EAF/CSP-T	散热片 Standard passive cooling solution for XTX module conga-XAF and ETX module conga-EAF, orange surface with 10mm fins and threaded standoffs. PDF数据手册	暂无价格	参考库存:44929
CONGA-TCA/CSP-B-HF	散热片 Standard passive cooling solution for COM Express module conga-TCA/CCA with 10mm fins. All standoffs are 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:44919
CONGA-QA6/CSP-B	散热片 PASSIVE COOLING SOL conga-QA6 2.7mm PDF数据手册	暂无价格	参考库存:44889
CONGA-QMX8/HSP-T	散热片 Standard heatspreader for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:44789
CONGA-MA30/CSP-B	散热片 Standard passive cooling solution for COM Express Type 10 module conga-MA3, conga-MA3E and conga-MA4 with fins. All standoffs are 2.7mm bore hole PDF数据手册	暂无价格	参考库存:44664
CONGA-MA5/CSP-B	散热片 Passive cooling solution for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:44574
CONGA-B7AC/HSP-CU-B	散热片 Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for modules with TDP up to 17W * Cu = Copper plate * B = Bore hole standoffs PDF数据手册	暂无价格	参考库存:44544
CONGA-TS67 HSP-HP-T	散热片 Standard heatspreader for high performance COM Express Type 6 module conga-TS67 with integrated heat pipes. All standoffs are with 2.5mmthreaded hole. PDF数据手册	暂无价格	参考库存:44467
CONGA-PA3/CSP	散热片 Passive cooling solution for conga-PA3 pico-ITX. PDF数据手册	暂无价格	参考库存:44437
CONGA-QA3/CSP-B	散热片 Standard heatspreader for Qseven module conga-QA3. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:44367
CONGA-TS170/CSA-HP-T	散热片 Standard active cooling solution for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes, 15mm silver fins, 21mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. PDF数据手册	暂无价格	参考库存:44242
CONGA-TS170/HSP-HP-T	散热片 Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are M2.5mm thread. PDF数据手册	暂无价格	参考库存:44202
CONGA-BM57/CSP-HP-B	散热片 PASSIVE COOLING SOL conga-BM57 2.7mm PDF数据手册	暂无价格	参考库存:44157
CONGA-XAF/EAF/CSP-B	散热片 Standard passive cooling solution for XTX module conga-XAF and ETX module conga-EAF, orange surface with 10mm fins and borehole standoffs. PDF数据手册	暂无价格	参考库存:44057
CONGA-SA5/CSP-T	散热片 Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread. PDF数据手册	暂无价格	参考库存:44042
CONGA-B7XD/HSP-VP-B	散热片 Standard heatspreader for high performance COM Express Type 7 module conga-TSXD with integrated vapor chamber. All standoffs are M2.5mm thread. PDF数据手册	暂无价格	参考库存:43822