congatec设计生产的散热片型号列表第4页

商品目录

散热片：151 条相关产品

型号	描述	参考价格	库存数量
CONGA-TFS/CSA-T	散热片 Standard active cooling solution for high performance COM Express module conga-TFS with 15mm fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. PDF数据手册	暂无价格	参考库存:41011
CONGA-BAF/CSA-T	散热片 ACTIVE COOLING SOL conga-BAF 2.5mm PDF数据手册	暂无价格	参考库存:40971
CONGA-XAF/EAF/HSP-T	散热片 Standard heatspreader for XTX module conga-XAF. All standoffs are M2.5mm threaded. PDF数据手册	暂无价格	参考库存:40956
CONGA-CA6/HSP-T	散热片 HEATSPREADER FOR conga-CA6 2.5mm PDF数据手册	暂无价格	参考库存:40921
CONGA-QG/CSP-T	散热片 Standard passive cooling for Qseven module conga-QG. All standoffs are M2.5mm threaded. PDF数据手册	暂无价格	参考库存:40804
CONGA-ELX/DEEP DRAWN HSP-B	散热片 HEATSPREADER FOR conga-ELX 2.7mm DD PDF数据手册	暂无价格	参考库存:40769
CONGA-MA5/HSP-B	散热片 Standard heatspreader for COM Express Mini Type10 module conga-MA5 with open silicon Intel Pentium and Celeron processor. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:40674
CONGA-QG/CSP-B	散热片 Standard passive cooling for Qseven module conga-QG. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:40669
CONGA-QA5/I-HSP-B	散热片 Standard heatspreader for Qseven module conga-QA5 with lidded Intel Atom processor. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:40619
CONGA-QAF/HSP-B	散热片 HEATSPREADER FOR conga-QAF 2.7mm PDF数据手册	暂无价格	参考库存:40584
CONGA-TS170/HSP-HP-B	散热片 Standard heatspreader for high performance COM Express modules conga-TS170/TS175 with integrated heat pipes. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:40544
CONGA-TCA/CSP-B-LF	散热片 Standard passive cooling solution for COM Express modules conga-TCA/CCA with 3mm fins. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:40534
CONGA-PA3/HSP-B	散热片 Heatspreader solution for conga-PA3 pico-ITX. PDF数据手册	暂无价格	参考库存:40519
CONGA-SMX8/I-HSP-B	散热片 Backlight power cable for Pico-ITX to connect LCD panel AUO G170EG01 V.1 (panel part number #10000132 17'' LVDS Panel G170EG01 V.1) for conga-PA5. PDF数据手册	暂无价格	参考库存:40489
CONGA-TC170/HSP-B	散热片 Standard heatspreader for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole. PDF数据手册	暂无价格	参考库存:40309
CONGA-ELX/DEEP DRAWN HSP-T	散热片 HEATSPREADER FOR conga-ELX/DD 2.5mm PDF数据手册	暂无价格	参考库存:40297
CONGA-BM57/HSP-HP-T	散热片 HEATSPREADER FOR conga-BM57 2.5mm PDF数据手册	暂无价格	参考库存:40245
CONGA-B7AC/HSP-CU-T	散热片 Standard heatspreader for COM Express Basic Type 7 module conga-B7AC with integrated copper plate. Intended for versions up to 17W TDP * Cu = Copper plate * T = M2.5 threaded standoffs PDF数据手册	暂无价格	参考库存:40235
CONGA-QMX6/HSP1-T	散热片 Standard heatspreader (with 1mm Gap Pad) for Qseven module conga-QMX6 with CPU in LIDDED FCBGA package. Intended for following QMX6 modules: conga-QMX6/iDC-1G eMMC2 (P/N 016112) conga-QMX6/iQC-1G eMMC2 (P/N 016113) PDF数据手册	暂无价格	参考库存:40018
CONGA-TCA3/CSP-T-HF	散热片 Standard passive cooling solution for COM Express module conga-TCA3 with 10mm fins. All standoffs are M2.5mm thread. PDF数据手册	暂无价格	参考库存:40003