| 图片 | 型号 | 制造商 | 描述 | 参考价格 | 库存数量 | 询价 |
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CPU与芯片冷却器 Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
PDF数据手册
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暂无价格
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参考库存:49115
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CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on open silicon Pentium and Celeron processors and heat sink with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
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暂无价格
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参考库存:48975
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * T = M2.5 Thread
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暂无价格
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参考库存:48910
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:48735
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR4 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
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暂无价格
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参考库存:48650
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CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are with 2.7mm bore hole.
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暂无价格
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参考库存:48640
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP higher than 17W * VC= Vapor Chamber * T =M2.5
PDF数据手册
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暂无价格
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参考库存:48530
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CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are with 2.7mm bore hole, 15mm fins, 18mm overall heat sink height and integrated 12V fan.
PDF数据手册
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暂无价格
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参考库存:48470
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan.Intended for modules with TDP higher than 17W * VC = vapor
PDF数据手册
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暂无价格
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参考库存:48055
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CPU与芯片冷却器 Passive cooling solution for conga-PA5 based on lidded Atom E3900 processors with 12mm heatsink fins. All standoffs are with 2.7 mm threaded hole.
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暂无价格
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参考库存:48025
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CPU与芯片冷却器 Standard passive cooling solution for COM Express modules conga-TC97, TC170 and TC175. All standoffs are M 2.5 threaded
PDF数据手册
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暂无价格
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参考库存:47960
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Basic Type 7 module conga-B7AC with integrated vapor chamber, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP higher than 17W * VC = Vapo
PDF数据手册
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暂无价格
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参考库存:47935
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CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX8 ARM Cortex A72 processor. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:47855
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CPU与芯片冷却器 Standard active cooling solution for COM Express modules conga-TC87. All standoffs are M 2.5 threaded, 13mm fins, 23mm overall heat sink height and integrated 12V fan.
PDF数据手册
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暂无价格
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参考库存:47670
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CPU与芯片冷却器 Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * T = M2.5 thre
PDF数据手册
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暂无价格
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参考库存:47445
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CPU与芯片冷却器 Standard passive cooling solution for COM Express module conga-TC87 with 20mm high cooling fins. All stand-offs are M2.5mm threaded.
PDF数据手册
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暂无价格
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参考库存:47435
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are with 2.7mm bore hole.
PDF数据手册
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暂无价格
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参考库存:47405
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CPU与芯片冷却器 Standard active cooling solution for high performance COM Express Type 7 module conga-TSXD with integrated heat pipes, 70mm radial 12V PWM fan and 30mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:47325
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CPU与芯片冷却器 Standard active cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins, 20mm overall heat sink height and integrated 12V fan. Intended for modules with TDP up to 17W * Cu = Copper plate * B = 2.7mm Bor
PDF数据手册
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暂无价格
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参考库存:47265
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CPU与芯片冷却器 Standard passive cooling solution for high performance COM Express module conga-TR3 with integrated heat pipes, 15mm fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
PDF数据手册
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暂无价格
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参考库存:47195
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