| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 Passive cooling solution for conga-PA3. Includes conga-PA3/HSP heatspreader and heat sink with 12mm fins. All standoffs are with 2.7 mm bore hole.
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暂无价格
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参考库存:39578
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散热片
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散热片 Compression Mounting Clamp Assemblies for Semiconductors to 57.2mm Diameter, 115.1mm to 124.7mm
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暂无价格
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参考库存:39583
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散热片
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散热片 Chipset Heatsink, Elliptical, 29mm Chip Size, 27.6mm Height, Aluminum, Black Anodized
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暂无价格
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参考库存:39588
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散热片
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散热片 BGA Heatsink, 19x23mm, Front Plastic Push Pin
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暂无价格
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参考库存:39593
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散热片
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散热片 Heat Pipe, Copper, High Performance, Round, 400mm, 10mm dia.
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1:¥200.8575
10:¥189.0264
25:¥177.1953
50:¥165.3642
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参考库存:39598
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