| 图片 | 型号 | 制造商 | 分类 | 数据手册 | 描述 | 参考价格 | 库存数量 |
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散热片
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散热片 BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 31.75x31.75x9.5mm, 31.75mm dia.
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暂无价格
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参考库存:44022
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散热片
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散热片 BGA Cooling Solutions with superGRIP Attachment, High Performance, 21x21x17.5mm
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1:¥130.402
10:¥123.17
50:¥108.6495
100:¥101.4288
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参考库存:44027
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散热片
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散热片 Board Level Heatsink for TO-220, TO-220-Single Gauge, Vertical Mounting, 6.45x20.32x19.71mm
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暂无价格
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参考库存:44032
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散热片
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散热片 BGA Push Pin Heatsink with Attachment, 45.2x41.4x11.89mm, Black Anodized, IC Pkg Size = 45 x 45, Plastic Pins, Pad
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暂无价格
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参考库存:44037
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散热片
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散热片 Passive cooling solution for SMARC 2.0 module conga-SA5 with open silicon Intel Pentium and Celeron processor. All standoffs are M2.5mm thread.
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暂无价格
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参考库存:44042
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